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采用“铆钉法”制备了Ti-Ni扩散偶,即将预处理后的镍丝嵌入到块状钛基体中,制备包含“准相界面”的样品。观察在500~700℃真空烧结时钛镍界面的扩散情况,总结了烧结温度对扩散层厚度的影响。研究表明,扩散层的厚度随烧结温度的升高而增厚,且温度与厚度满足指数变化关系。
A Ti-Ni diffusion pair was prepared using a “rivet method”, in which a pre-treated nickel wire was embedded in a bulk titanium matrix to prepare a sample containing the “in-phase interface”. The diffusion of Ti-Ni interface during vacuum sintering at 500 ~ 700 ℃ was observed. The influence of sintering temperature on the thickness of diffusion layer was summarized. The results show that the thickness of the diffusion layer increases with the increase of the sintering temperature, and the temperature and the thickness of the diffusion layer satisfy the exponential relationship.