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应用直通硅晶穿孔(TSV)技术的三维集成电路(3D IC)为半导体业界提供全新境界的效率、功耗、效能及体积优势。然而,若要让3D IC成为主流,还必须执行许多基础的工作。电子设计自动化(EDA)厂商提供的解决方案支援3D IC变革,包括模拟与数字设计实现、封装与印刷电路板(PCB)设计工具。半导体厂可以运用这个解决方案,满足高效率设计应用TSV技术的3D IC的所有需求。
Three-dimensional integrated circuits (3D ICs) using through-silicon vias (TSV) technology provide the semiconductor industry with new levels of efficiency, power, performance, and volume advantages. However, to make the 3D IC mainstream, you have to perform a lot of basic work. Electronic Design Automation (EDA) vendors offer solutions that support 3D IC changes, including analog and digital design implementation, package and printed circuit board (PCB) design tools. Semiconductor manufacturers can use this solution to meet all the demands of efficiently designing 3D ICs for TSV applications.