论文部分内容阅读
市场研究机构IC Insights近日公布了最新的2016~2020年全球晶圆产能报告,显示全球营运中的12英寸(300mm)晶圆厂数量持续成长,预期在2016年可达到100座。IC Insights报告中其他关于12英寸晶圆厂重点还包括:有几座预定2013年开幕的晶圆厂延迟到了2014年;而随着台湾厂商茂德(ProMOS)的两座大型12英寸厂在2013年关闭,导致营运中的12英寸晶圆厂数量在2013首度减少。截至2015年底,全球有95座量产级的IC厂采用12英寸晶圆(有大量研发芯片厂以及少数生产非IC产品,例如CMOS影像传感器的量产晶圆厂,但不包括在统计中)。
IC Insights, a market research firm, recently released its latest global wafer capacity report for 2016-2020, showing that the number of 12-inch (300mm) fabs in operation worldwide continues to grow and is expected to reach 100 in 2016. Other highlights of the 12-inch fab in the IC Insights report include several wafer fabs scheduled to open in 2013 to be delayed by 2014 and two large 12-inch plants in Taiwan by ProMOS makers in 2013 Shut down, resulting in the first decline in the number of 12-inch fabs in operation in 2013. As of the end of 2015, 95 mass-production IC plants worldwide use 12-inch wafers (a large number of R & D chip fabs and a few mass-production fabs that produce non-IC products such as CMOS image sensors but are not included in the statistics) .