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COB(ChipOnBoard)与晶粒尺寸封装(CSP)技术,正快速走红发光二极体(LED)照明市场。COB封装可缩小LED光源尺寸,而CSP则能省却后段封装及导线架费用,皆有助大幅降低LED光源的整体物料清单(BOM)成本,因而成为今年磊晶厂积极采用的热门封装技术,包括日亚化学(Nichia)、科锐(Cree)及隆达,皆已陆续发布相关产品。隆达电子照明成品事业处处长黄道恒表示,无封装LED可满足灯具系统开
COB (ChipOnBoard) and die size package (CSP) technology, is rapidly popular LED (light emitting diode) lighting market. COB package can reduce the size of the LED light source, and CSP can save the cost of back-end package and lead frame, all will help significantly reduce the overall bill of materials (BOM) cost of LED light source, which has become epitaxial plant active packaging industry this year, Including Nichia, Cree and Lunda, have released the relevant products. Lunda electronic lighting products business director David Wong said that no package LED lamps can meet the system to open