聚酰亚胺(PI)由于其高度的耐热性、绝缘性和抗辐射性,早就引起人们的重视,六十年代已广泛用于各种电器的绝缘,成为一种理想的耐热绝缘材料。它优越的抗辐射性能使之大量应用于空间技术中作为防辐射材料,然而聚酰亚胺在微电子技术中的应用还是近几年的事情,这是因它在使用时,通常须先用可溶性的聚酰胺酸(PA)在电子器件表面涂布制成薄膜,再经加温处理转变为不溶不熔的聚酰亚胺,但因聚酰胺酸溶液在室温下容易降解,保存期极短,而且又没有感光 Polyimide (PI) has long attracted people’s attention due to its high heat resistance, insulation and radiation resistance. It has been widely used in various electrical appliances in the 1960s as an ideal heat-resistant insulation material. Its excellent anti-radiation properties make it widely used in space technology as a radiation protection material, however, the application of polyimide in microelectronics technology is still a matter of recent years. This is because it is usually used first Soluble polyamic acid (PA) is coated on the surface of the electronic device to form a thin film, which is then converted into an insoluble and infusible polyimide through thermal treatment. However, the polyamic acid solution is easily degraded at room temperature and has a very short shelf life , But no sense of light