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利用微机电系统(MEMS)技术,制作了一种128×1元柔性红外传感器阵列.首先在硅片衬底上生长一层 PDMS 柔性材料,然后再在柔性材料上利用 MEMS 技术制作红外传感器阵列.采用六轴微小器件试验台进行扭弯试验.在传感器的两端施加一定的力使其弯曲,然后测传感器不同单元的电阻.试验结果表明:所制作的柔性传感器阵列能经受多次弯扭,电阻值基本没有变化,柔性传感器在经过弯扭3 300次后,传感器本身的柔性材料并没有断.
A 128 × 1 element flexible infrared sensor array was fabricated by using MEMS technology.Firstly, a layer of PDMS flexible material was grown on a silicon substrate, and then an infrared sensor array was fabricated on the flexible material by MEMS technology. The twisting test was carried out on a six-axis micro device test bench, a certain force was applied to both ends of the sensor to bend it, and then the resistance of different units of the sensor was measured. The experimental results show that the flexible sensor array produced by the invention can withstand bending and twisting multiple times, The basic value of the resistance has not changed, the flexible sensor after bending 3 300 times, the sensor itself is not broken off the flexible material.