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运用ANSYS软件建立了有限元模型,对直流等离子体喷射制备的自支撑金刚石厚膜在脱离基体前、后的残余应力分别进行了数值模拟。为了使模拟更接近于金刚石膜的真实制备环境,本文取消了以往对金刚石膜或基体内的温度场常作的均匀或线性的人为假设,而采用对从磁控直流等离子体炬内喷射出的射流仿真计算结果。结论如下(:1)金刚石膜脱离基体之前,金刚石厚膜内的热残余应力呈空间应力状态,第一主应力在膜层中心以外的大部分地方均为拉应力,易引起膜开裂破坏;膜/基界面上极大的剪切应力是引起金刚石膜从基体上脱离的主要原因。(2)金刚石膜脱离基体之后,热残余应力绝大部分被释放,膜内最终的残余应力可认为是本征应力。
The finite element model was established by ANSYS software. The residual stress of free-standing diamond thick film prepared by direct current plasma jet spraying before and after being separated from the substrate was numerically simulated. In order to make the simulation closer to the real fabrication environment of the diamond film, this paper cancels the conventional assumption of uniform or linear temperature field in the diamond film or matrix, Jet simulation results. The conclusions are as follows: (1) The thermal residual stress in the diamond thick film is in a state of spatial stress before the diamond film is separated from the matrix. The first principal stress is tensile stress in most places except the center of the film, The great shear stress at the base interface is the main cause of the diamond film detachment from the substrate. (2) After the diamond film is separated from the matrix, the thermal residual stress is largely released, and the residual residual stress in the film can be regarded as the intrinsic stress.