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随着混合IC中厚膜电阻用量的增加,它们的稳定性和生产重复性就显得十分重要。影响电阻重复性和稳定性的因素很多:如电阻体、导体浆料、基板材料,以及印刷、干燥、烧成、修整等生产工序。在影响厚膜电阻体电气特性的这些因素中,有关浆料本身组成和电阻制造工艺对烧成后TCR和噪声等影响,已进行了许多研究,并作了详细的观察分析。可是,电阻体的电特性与其几何形状尺寸以及在基板上元件的布置等设计参数亦有关
As the amount of thick film resistors in hybrid ICs increases, their stability and reproducibility become important. Resistor repeatability and stability of many factors: such as resistors, conductive paste, the substrate material, and printing, drying, firing, finishing and other production processes. Among these factors that affect the electrical characteristics of the thick-film resistor, many studies have been conducted on the composition of the paste itself and the influence of the manufacturing process of the resistor on the post-firing TCR and noise, and detailed observations have been made. However, the electrical properties of the resistor are also related to the design parameters such as the geometry and dimensions and the layout of the components on the substrate