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采用线性电位扫描法、循环伏安法、电导测定及ＸＲＤ，ＸＰＳ法等研究了高浓度Ｂｉ３＋离子存在于酸性ＣｕＳＯ４电解液中对Ｃｕ电解精炼阴极过程的影响．研究表明：Ｂｉ３＋离子的存在减小了电解液的电导率，降低了阴极Ｃｕ沉积反应的交换电流密度、极限电流密度和峰电流密度，对Ｃｕ沉积反应起极化作用、在通常电流密度２００ Ａ·ｍ－２下电解，Ｂｉ不会在阴极沉积，但促使Ｃｕ沉积的晶面２２０择优取向更加突出．在高电流密度１０００ Ａ·ｍ－２下电解，Ｂｉ以Ｂｉ２Ｏ３形式存在于沉积层中，Ｃｕ沉积的晶面择优取向为１１１．
The effects of high concentration of Bi3 + ion in acidic CuSO4 electrolyte on the cathodic process of Cu electrolysis were studied by linear potential sweep, cyclic voltammetry, conductivity measurement, XRD and XPS. The results show that the existence of Bi3 + ions can reduce the conductivity of the electrolyte and reduce the exchange current density, the limiting current density and the peak current density of the cathodic Cu deposition reaction, which can polarize the Cu deposition reaction. At the current density of 200 A · Under m-2 electrolysis, Bi does not deposit on the cathode, but the preferred orientation of the Cu-deposited crystal face 220 is more prominent. Under high current density of 1000 A · m-2 electrolysis, Bi is present in the deposited layer as Bi2O3. The preferred orientation of the Cu-deposited crystal plane is 111.