可编程器件行业有两种关键发展趋势。目前最大的FPGA器件的逻辑单元数量很容易超过100万。此外,要求提高系统级性能,减小PCB尺寸也带来了在一个器件封装中组合实现各种半导体功能的需求,例如,处理器和存储器。这类器件一些是单管芯的,一些是多管芯解决方案。未来,多管芯解决方案会更加普遍,因此,理解其对设计的影响非常重要。本文介绍了单管芯(单片) There are two key trends in the programmable device industry. The largest FPGA devices currently have more than a million logic cells. In addition, the need to improve system-level performance and reduce PCB size has also brought the need to combine various semiconductor functions in a single device package, such as processors and memory. Some of these devices are single-die and some are multi-die solutions. In the future, multi-die solutions will become more prevalent, so understanding the impact on design is important. This article describes the single-die (monolithic)