论文部分内容阅读
以Ag-Cu合金废触点制备CuCl2和AgCl,采用葡萄糖预还原-水合肼二次还原法制备超细铜粉、氨-肼还原法制备超细银粉。结果表明:在反应温度为70℃,加入适量PVP和苯并三氮唑作为分散剂和抗氧化剂的条件下,所得微米级铜粉的粒度在0.3～0.6μm,粒度分布范围小,纯度高于99.9%。经3个月的抗氧化试验表明,所得铜粉产品的抗氧化性能较高。一定时间的球磨是氨-肼还原法制备超细银粉的关键,经24h湿法球磨后干燥所得银粉的粒度为1.90μm,分布均匀。
CuCl 2 and AgCl were prepared by spent contact of Ag-Cu alloy, ultrafine copper powder was prepared by pre-reduction of glucose and hydrazine hydrate, and ultrafine silver powder was prepared by ammonia-hydrazine reduction method. The results showed that under the condition of reaction temperature 70 ℃, proper amount of PVP and benzotriazole as dispersant and antioxidant, the micron-sized copper powder obtained had a particle size of 0.3-0.6 μm, a small particle size distribution range and a high purity 99.9%. After 3 months of anti-oxidation test showed that the resulting copper oxide products higher oxidation resistance. The ball mill for a certain time is the key to the preparation of ultrafine silver powder by the ammonia-hydrazine reduction method. After being wet-milled for 24h, the resulting silver powder has a particle size of 1.90 μm and uniform distribution.