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采用红外光谱(FT-IR)和核磁共振(29S i NMR)对3,3’-二(3-三甲氧基硅丙基)双酚A环氧树脂(SEP)进行了结构表征,并对其性能和固化进行了研究。该树脂为含烷氧硅基的环氧树脂,室温下可流动,室温下黏度比E51大,在60℃以上黏度相近。采用表干时间、DSC和FT-IR等对SEP的湿固化研究结果表明,该环氧树脂通过硅氧烷水解缩合而固化,表干时间随固化温度升高而减小。该环氧树脂可以像E-51一样用胺类固化剂进行固化,低温下凝胶时间稍长,90℃以上比较接近。
The structure of 3,3’-bis (3-trimethoxysilylpropyl) bisphenol A epoxy resin (SEP) was characterized by FT-IR and 29S NMR. Performance and curing were studied. The resin is an alkoxysilyl-containing epoxy resin, which is flowable at room temperature and has a higher viscosity at room temperature than the E51, with viscosities above 60 ° C. The results of wet curing of SEP with surface dry time, DSC and FT-IR show that the epoxy resin is cured by hydrolysis and condensation of siloxane, and the surface dry time decreases with the increase of curing temperature. The epoxy resin can be cured like an E-51 with an amine hardener. The gel time is slightly longer at low temperatures and closer to 90 ° C.