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红外焦平面需要用互连技术把光敏元阵列与信号读出电路进行互连,利用化学镀的方法,在32×32非致冷红外焦平面阵列的CMOS读出电路上镀直径为6μm,高度为2μm的互连柱。测试结果表明,该技术稳定可靠,是实现接触孔互连的可行方法。
The infrared focal plane needs the interconnection technology to interconnect the photosensitive element array with the signal readout circuit. By using the electroless plating method, the CMOS readout circuit of a 32 × 32 uncooled infrared focal plane array is coated with a diameter of 6 μm and a height 2μm interconnect column. The test results show that the technique is stable and reliable, which is a feasible method to realize contact hole interconnection.