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研究了挠性印制电路板(FPC)用超低轮廓(VLP)电解铜箔的表面处理工艺。在硫酸铜与硫酸的混合电解液中,以连续旋转鼓状钛筒为阴极,在50~80 A/dm2的电流密度下电沉积得到12μm厚的铜箔,再以(20±0.1)m/min的速度对铜箔进行表面处理:在其光面进行分形电沉积铜,然后电沉积纳米锌镍合金,再经过三价铬钝化处理并涂覆一层硅烷偶联剂。处理后的铜箔光面呈黑色,粗糙度为1.2~2.0μm,毛面粗糙度≤2.5μm,不含铅、汞、镉、砷等有害元素,具有优异的抗剥离强度以及抗氧化、耐腐蚀和蚀刻性能,可以替代同类型的进口铜箔,应用于FPC制作和高密度互联(HDI)内层板等。以该工艺生产的VLP铜箔已在FPC生产厂家获得应用。
The surface treatment of ultra-low profile (VLP) electrolytic copper foil for flexible printed circuit (FPC) was studied. In a mixed electrolyte of copper sulfate and sulfuric acid, a copper foil with a thickness of 12 μm is electrodeposited at a current density of 50-80 A / dm 2 by continuously rotating a drum with a titanium cylinder as a cathode, and then a copper foil with a thickness of (20 ± 0.1) m / min speed of copper foil surface treatment: the smooth surface of the electrodeposited copper, and then electrodeposition of zinc-nickel alloy, and then through the trivalent chromium passivation and coating a layer of silane coupling agent. The treated copper foil has a smooth black surface with a roughness of 1.2-2.0 μm and a matte surface roughness of less than or equal to 2.5 μm. It contains no harmful elements such as lead, mercury, cadmium and arsenic, has excellent peel strength and resistance to oxidation, Corrosion and etching properties, can replace the same type of imported copper foil, used in FPC production and high-density interconnect (HDI) inner plate and so on. The VLP copper foil produced by this process has been used by FPC manufacturers.