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超声无损检测是70种无损探伤技术的最热点。扫描声学显微镜(SAM)的原理是声阻抗成像,要求缺陷尺度大于超声波的波长。结合SAM技术中的A-扫描波形分析和C-扫描特征成像,针对由封装引入的分层和空洞缺陷进行失效分析。研究发现:分层定位的关键是A-扫描波形分析中对各界面处反射波的时间位置的判断;基于分层定位的芯/焊结合空洞缺陷的判别,关键是C-扫描图像中灰阶色带的区分(反射率差值)。
Ultrasonic nondestructive testing is the hottest spot for 70 nondestructive testing techniques. The principle of scanning acoustic microscopy (SAM) is acoustic impedance imaging, which requires that the defect size be greater than the wavelength of the ultrasound. Combined with the A-scan waveform analysis and C-scan feature imaging in SAM technology, failure analysis is performed on the delamination and void defects introduced by the package. It is found that the key to the layered positioning is the judgment of the time position of the reflected wave at each interface in the A-scan waveform analysis. The key to determine the core / weld combined cavity defects based on the layered positioning is that the grayscale in the C-scan image Ribbon distinction (reflectivity difference).