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以纳米粒子SiO2为核、表面活性剂N,N-十二基-N-甲基-N-(3-三甲氧基甲硅烷基丙基)氯化铵(SID3392)为颈状层、聚(乙二醇)4-壬基苯基醚3-磺丙基钾盐(PEGS)为冠状层,制备出了无溶剂纳米SiO2流体。无溶剂纳米SiO2流体为牛顿流体,在室温下具有较低的黏度,在26.5℃时其黏度为4.3Pa·s,无溶剂纳米SiO2流体中SiO2的含量为13.65wt%。将该无溶剂纳米SiO2流体加入环氧树脂中,制备了无溶剂纳米SiO2流体/环氧树脂复合材料。TEM结果表明:无溶剂纳米SiO2流体在环氧树脂基体中具有良好的分散性。DSC测试表明:无溶剂纳米SiO2流体的加入会略微降低环氧树脂的固化温度。当纳米SiO2流体加入量为2.5wt%时,复合材料的冲击性能提高了164.7%,玻璃化温度提高了15.4℃。断面SEM结果显示无溶剂纳米SiO2流体能够提高环氧树脂的韧性。
Using nano-SiO2 as nucleus and surfactant as N-dodecyl-N-methyl-N- (3-trimethoxysilylpropyl) ammonium chloride (SID3392) Ethylene glycol) 4-nonylphenyl ether 3-sulfopropyl potassium salt (PEGS) as the corona layer to prepare a solvent-free nano-SiO2 fluid. Solvent-free nanosilica fluid is a Newtonian fluid with a lower viscosity at room temperature, a viscosity of 4.3 Pa · s at 26.5 ° C, and a SiO2 content of 13.65 wt% in a solvent-free nanosilica fluid. The solventless nano-SiO2 fluid was added to the epoxy resin to prepare a solvent-free nano-SiO2 fluid / epoxy composite. TEM results show that: solvent-free nano-SiO2 fluid in the epoxy matrix has good dispersion. DSC tests show that the addition of solvent-free nanosilica fluid slightly decreases the curing temperature of the epoxy resin. When the nano-SiO2 fluid is added in an amount of 2.5wt%, the impact property of the composite is improved by 164.7% and the glass transition temperature is increased by 15.4 ℃. Cross-sectional SEM results show that solvent-free nano-SiO2 fluid can improve the toughness of epoxy resin.