一、引言 所谓硅片弯曲度,就是硅片处于无夹持状态下,相对于一个理想平面单纯凹和凸的体形变。或者说把硅片放置于一平台上,并以此平台为零点,用一轻压机械量度仪器从硅片上面测量硅片正反二面厚度的差。 在切片过程中,硅片要产生一定的弯曲度。硅片弯曲度的变化,将直接影响其厚度 First, the introduction The so-called silicon curvature, that is, the wafer is in a non-clamping state, relative to an ideal plane simply concave and convex body shape change. Or put the silicon on a platform, and the platform for the zero, with a soft mechanical measuring instrument from the silicon surface to measure the difference between the positive and negative silicon thickness. In the slicing process, silicon to produce a certain degree of curvature. Changes in silicon curvature, will directly affect the thickness