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12～28mA/cm2范围内,采用AlCl3-EMIC(氯化1-甲基-3-乙基咪唑)熔盐电沉积法在18～40℃获得铝镀层,用X射线衍射(XRD)仪和扫描电子显微镜(SEM)研究其织构与形貌。结果表明,铝镀层呈(200)晶面择优取向,其相对衍射峰强度随电流密度和沉积温度升高而减弱,随镀层厚度增加而增强。厚度为8μm时镀层择优取向最明显,其表面颗粒呈棱锥状均匀紧密排列。电流密度为12mA/cm2时,随温度升高镀层由(200)晶面择优取向转变为(200)和(222)晶面择优取向,其表面颗粒随之由较均匀的棱锥状转变为不规则的核桃仁状。讨论镀层织构形成的可能机制。
Aluminum coating was obtained by using AlCl3-EMIC (1-methyl-3-ethylimidazolium chloride) molten salt electrodeposition at 18 ~ 40 ℃ in the range of 12 ~ 28mA / cm2. XRD and scanning Electron microscopy (SEM) to study its texture and morphology. The results show that the preferred orientation of the (200) crystal plane of aluminum coating is. The relative diffraction peak intensity decreases with the increase of current density and deposition temperature, and increases with the increase of coating thickness. When the thickness is 8μm, the preferred orientation of the coating is the most obvious, and the surface of the coating is pyramid-like and closely arranged. At the current density of 12mA / cm2, the preferred orientation of the (200) and (222) planes changes from the preferred orientation of the (200) plane to the preferred orientation of the (222) plane as the temperature increases. The surface grains change from a more uniform pyramid to an irregular Walnut shape. Discuss the possible mechanism of coating texture formation.