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提出了计算高Cu/Mg比Al-Cu-Mg-Ag合金主要析出相Ω相及相界面电子结构的计算模型与方法,从合金相结构因子和相界面结合因子分析了合金的强化机制。基于余氏的固体分子经验电子理论和程氏改进的TFD理论,对Al-Cu-Mg-Ag合金主要析出相?相及相界面电子结构进行了计算,发现合金相及相界面价电子结构与合金强化机制有密切的关系,并从电子结构层次上阐释分析了合金中θ′,Ω,θ相的竞争相析出机制及对合金强化机制的影响。
A computational model and method for calculating the phase and interfacial electronic structures of the main precipitated phases of Al-Cu-Mg-Ag alloy with high Cu / Mg ratio were proposed. The strengthening mechanism of the alloy was analyzed based on the alloy phase structure factors and interfacial interfacial bonding factors. Based on the experience of Yu’s solid-state electron theory and Cheng’s improved TFD theory, the main precipitates-phase and interphase electronic structures of Al-Cu-Mg-Ag alloys were calculated. It was found that the valence electron structures The strengthening mechanism of the alloy is closely related. From the electronic structure level, the competitive phase precipitation mechanism of θ ’, Ω and θ phases in the alloy and its effect on the strengthening mechanism of the alloy are analyzed.