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为了满足广泛的热成像应用的需要,人们正在研制非致冷型红外焦平面列阵.消防、日常维修、生产过程的控制和温度记录只是热成像技术在工业上的一小部分应用,它们都将得益于非致冷型红外探测器。因此,人们已研究出一种像元间距为35μm的非致冷型红外探测器工艺,利用这种工艺可以生产高性能的160×120元和384×288元列阵,除此之外,为了满足生产流程控制和更为精确的炉温控制等工业应用的要求,一种像元间距为45μm的320×240元非致冷型宽带探测器也已研制成功。法国ULIS公司的非晶硅工艺技术很适合用来大量生产低成本的探测器,本文先简单介绍微测辐射热计工艺技术的背景,然后对像元间距为35μm的探测器以及像元间距为45μm的320×240元宽带红外焦平面列阵进行表征。
In order to meet the needs of a wide range of thermal imaging applications, non-cooling infrared focal plane arrays are being developed.Fire protection, routine maintenance, process control and temperature recording are just a few of the industrial applications of thermal imaging technology Will benefit from non-refrigeration infrared detector. Therefore, a non-refrigeration type infrared detector with a cell pitch of 35 μm has been developed to produce high-performance arrays of 160 × 120 pixels and 384 × 288 cells. In addition, To meet the production process control and more accurate temperature control and other industrial applications, a cell spacing of 45μm 320 × 240 non-refrigerated broadband detector has been successfully developed. France ULIS amorphous silicon process technology is suitable for mass production of low-cost detectors, this paper briefly introduces the background of the micro-bolometer process technology, and then the pixel spacing of 35μm detector and pixel spacing of 45μm 320 × 240 wideband infrared focal plane array were characterized.