如果当前的研制工作证明是有实效的,那么用激光就可以检查以及形成焊点。据马萨诸什州坎顿的Vanzetti红外与计算机系统公司说,他们已证实了用掺钕YAG激光探测印刷电路板上焊点缺陷的可能性。这家公司正在为萨克拉托的空军后勤中心建造一台基于这种激光技术的自动样机系统。 If the current development work proved to be effective, then the laser can be used to inspect and form solder joints. According to Vanzetti Infrared & Computer Systems Inc. in Canton, Massachusetts, they have confirmed the possibility of using neodymium-doped YAG lasers to detect solder joint defects on printed circuit boards. The company is building an automated prototype system based on this laser technology for the Air Force Logistics Center in Sacramento.