一、引言在设计集成电路单元结构时,为使集成电路结温降到可允许的范围之内,应该使集成电路结点到环境空气的热阻最小。对高密度集成电路的冷却方法,目前在印制板组件上大致有三种方式:导热条结构,印制板夹芯结构和扁平热管。但由于考虑制造工艺的现实性和成品率,目前国内应用得最为广 I. INTRODUCTION In designing integrated circuit cell structures, the thermal resistance of the integrated circuit junction to the ambient air should be minimized in order to reduce the junction temperature of the integrated circuit to within permissible limits. For high-density integrated circuit cooling method, PCB components currently there are roughly three ways: the thermal bar structure, printed circuit board sandwich structure and flat heat pipe. However, considering the reality of the manufacturing process and the yield, the most widely used in China