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SOC(System-on-chip)为系统级芯片,它是在单个硅片上集成一个系统,包括处理器、高密度逻辑电路、模拟和混合信号电路、存储器和通信电路等。由于SOC能提供更好的性能、更低的功耗、更小的印制板(PCB)空间和更低的成本,在半导体业界被视为继微处理之后的第二大热门产品。目前SOC被广泛用于移动电话、硬盘驱动器、PDA(个人数字助理)、机顶盒和手持电子产品等。目前SOC时代还没有真正到来,有众多因素制约SOC的迅速发展。传统上SOC一贯采用掩模ASIC来实现,因为ASIC具有最低的单位成本,并特别适用大批量订单的产品。但采用ASIC也存在以下缺点:1.要求更大的最小定货量(MOQ),对于0.6μm、6英寸圆片要求MOQ为1-5万圆片
SOC (System-on-chip) is a system-on-chip that integrates a system on a single silicon, including processors, high-density logic, analog and mixed-signal circuits, memories and communications circuits. As the SOC can provide better performance, lower power consumption, smaller PCB space and lower cost, the semiconductor industry is considered the second hotdest product after micro-processing. Currently SOC is widely used in mobile phones, hard drives, PDAs (personal digital assistants), set-top boxes and handheld electronics. At present the SOC era has not really come, there are many factors that restrict the rapid development of SOC. Traditionally, SOCs have been implemented with mask ASICs because ASICs have the lowest unit cost and are especially suited for high volume orders. However, the use of ASICs also has the following disadvantages: 1. Requires a larger MOQ, and for a 0.6μm, 6-inch wafer, a MOQ of 1-50000 wafers