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研究了调制磁场对于非平衡磁控溅射系统的作用 ,调制磁场可以使非平衡磁控溅射形成具有较高等离子体密度的等离子体束流 ,延伸到靶前 110 m m以上。在靶前 6 0～ 110 mm的位置上 ,收集电流密度高达 9～ 10 m A/ cm2 ,收集的电流密度比常规的磁控溅射方法高 9倍以上 ,在调制磁场作用下磁控溅射沉积铜薄膜的沉积速率可以增加到 14倍。
The effect of modulation magnetic field on unbalanced magnetron sputtering system was studied. The modulation magnetic field can make the plasma beam with high plasma density formed by unbalanced magnetron sputtering extend to more than 110 m before the target. The current density is as high as 9 ~ 10 m A / cm2 at the position of 60 ~ 110 mm above the target, and the current density is collected more than 9 times higher than the conventional magnetron sputtering method. The magnetron sputtering The deposition rate of the deposited copper film can be increased up to 14 times.