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三维高深宽比硅基结构是基于微纳制造技术的功能载体或执行机构。其由于小尺寸特征而获得特殊的微纳效应,具有灵敏度高、分辨率高、噪声低、位移量小等特点,在光电、生物、微能源和集成互连等技术领域具有广泛应用前景。主要分析了高深宽比硅基微纳结构的种类及特点;系统综述了该结构的制造方法及国内外研究现状;详细描述了不同外形特征结构的应用领域;从工艺标准、建模仿真、批量生产等方面讨论了高深宽比硅基微纳结构制造存在的技术瓶颈问题,并对高深宽比硅基微纳结构的可靠制造与发展趋势进行了展望。
The three-dimensional high aspect ratio silicon-based structure is a functional carrier or actuator based on micro-nano fabrication technology. Due to its small size characteristic, it has special micro-nano effect. It has the characteristics of high sensitivity, high resolution, low noise and small displacement. It has wide application prospect in optoelectronic, biological, micro-energy and integrated interconnection technologies. The types and characteristics of high aspect ratio silicon-based micro / nano structure are mainly analyzed. The manufacturing methods of the structure and the research status at home and abroad are reviewed systematically. The application fields of different shape features are described in detail. From the technical standards, modeling and simulation, Production and other aspects discussed the high aspect ratio silicon micro-nano structure of the manufacturing technology there is a bottleneck problem, and the high aspect ratio of the micro-nano structure of silicon-based reliable manufacturing and development trends are prospected.