BCB树脂具有良好的平坦化特性、电气特性和热稳定性,相比于聚酰亚胺等其他介质,它具有介电常数小,吸水率低,固化温度低和可靠性高等特点,可以用于进行沟槽填充。研究了一种采用BCB介质进行沟道填充的倒台结构脊波导激光器,并且优化了涂覆,固化以及刻蚀等工艺参数,与采用直台结构的脊波导激光器进行了性能对比,发现利用BCB介质进行沟道填充的芯片,具有更低的阈值电流,更小的串联电阻和热电阻,以及更高的斜率效率,各项技术参数均优于直台结构脊波导激光器。 BCB resin with good flatness, electrical properties and thermal stability, compared with other media such as polyimide, it has a small dielectric constant, low water absorption, low curing temperature and high reliability, can be used for Trench filling. A down-structured ridge waveguide laser with BCB dielectric channel filling was studied, and the processing parameters such as coating, curing and etching were optimized. Compared with the ridge waveguide laser with straight-line structure, the BCB dielectric Trench-filled chips with lower threshold current, smaller series resistance and thermal resistance, and higher slope efficiency, the technical parameters are better than the direct-track structure ridge waveguide laser.